Updated: 2021-03-25 14:43:00
Intel is back, said CEO Pat Gelsinger in an enthusiastic presentation entitled ‘Intel Unleashed’ yesterday. “We’re bringing back the execution discipline of Intel – the Grovian culture,” said Gelsinger who spent the first 30 years of his career at Intel under its first three CEOs: Bob Noyce, Gordon Moore and Andy Grove. Gelsinger has lost none of the ebullience which earned him the soubriquet Kickin’ Pat and he appears to be relishing the chance to return Intel to its glory days. View the full article HERE
Updated: 2021-03-25 10:35:18
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Updated: 2021-03-22 10:07:00
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Updated: 2021-03-22 02:24:47
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Updated: 2021-03-22 02:24:42
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Updated: 2021-03-22 02:24:41
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Updated: 2021-03-22 02:24:40
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Updated: 2021-03-22 02:24:36
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Updated: 2021-03-22 02:24:33
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Updated: 2021-03-22 02:24:30
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Updated: 2021-03-22 02:24:29
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Updated: 2021-03-22 02:24:28
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Updated: 2021-03-22 02:24:23
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Updated: 2021-03-22 02:24:21
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Updated: 2021-03-22 02:24:20
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Updated: 2021-03-22 02:24:19
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Updated: 2021-03-22 02:24:18
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Updated: 2021-03-22 02:24:14
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Updated: 2021-03-22 02:24:14
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Updated: 2021-03-22 02:24:13
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Updated: 2021-03-22 02:24:13
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Updated: 2021-03-22 02:24:12
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Updated: 2021-03-22 02:24:12
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Updated: 2021-03-22 02:24:11
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Updated: 2021-03-22 02:24:09
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Updated: 2021-03-22 02:24:08
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Updated: 2021-03-22 02:24:07
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Updated: 2021-03-22 02:24:07
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Updated: 2021-03-22 02:24:06
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Updated: 2021-03-22 02:24:04
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Updated: 2021-03-22 02:24:04
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Updated: 2021-03-22 02:24:03
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Updated: 2021-03-22 02:24:02
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Updated: 2021-03-22 02:24:00
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Updated: 2021-03-22 02:23:56
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Updated: 2021-03-22 02:23:54
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Updated: 2021-03-22 02:23:53
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Updated: 2021-03-22 02:23:53
Choose Language English æ¥æ¬èª íêµì´ ì¹ì¬ì´í¸ ä¸å½ç½ç« English Choose Language English æ¥æ¬èª íêµì´ ì¹ì¬ì´í¸ ä¸å½ç½ç« Skip to Content Blog Buy Local Buy Online Careers Data Sheets Quality Solder Alloy Guide Who We Are Careers Employee Bios Facilities Markets We Serve Media Center Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Silver Sintering Solders Thermal Interface Materials Thin-Film Materials Applications Connector Cable Assembly High-Temperature Soldering Brazing PCB Assembly Power Electronics Packaging Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Data Sheets Quality Tech Library Solder
Updated: 2021-03-22 02:23:52
Choose Language English æ¥æ¬èª íêµì´ ì¹ì¬ì´í¸ ä¸å½ç½ç« English Choose Language English æ¥æ¬èª íêµì´ ì¹ì¬ì´í¸ ä¸å½ç½ç« Skip to Content Blog Buy Local Buy Online Careers Data Sheets Quality Solder Alloy Guide Who We Are Careers Employee Bios Facilities Markets We Serve Media Center Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Silver Sintering Solders Thermal Interface Materials Thin-Film Materials Applications Connector Cable Assembly High-Temperature Soldering Brazing PCB Assembly Power Electronics Packaging Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Data Sheets Quality Tech Library Solder
Updated: 2021-03-22 02:23:52
Choose Language English æ¥æ¬èª íêµì´ ì¹ì¬ì´í¸ ä¸å½ç½ç« English Choose Language English æ¥æ¬èª íêµì´ ì¹ì¬ì´í¸ ä¸å½ç½ç« Skip to Content Blog Buy Local Buy Online Careers Data Sheets Quality Solder Alloy Guide Who We Are Careers Employee Bios Facilities Markets We Serve Media Center Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Silver Sintering Solders Thermal Interface Materials Thin-Film Materials Applications Connector Cable Assembly High-Temperature Soldering Brazing PCB Assembly Power Electronics Packaging Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Data Sheets Quality Tech Library Solder
Updated: 2021-03-22 02:23:50
Indium Corporation® Indium Corporation Blog People Careers Employee Bios Facilities Markets We Serve Corporate Communications Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Solders Thermal Interface Materials Thin-Film Materials Applications Brazing High-Temperature Soldering Connector Cable Assembly PCB Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Contact Us Main INDIUM CORPORATION Blog Neue Einträge Die SMT-Bestückung ist ein Optimierungsprozess Sunday , February 28, 2021 Leute , die SMT-Bestückung ist ein Optimierungsprozess . Es gibt nicht den einen Schablonendruckprozess für alle Leiterplattenausführungen . Die
Updated: 2021-03-22 02:23:48
Indium Corporation® Blog de Indium Corporation People Careers Employee Bios Facilities Markets We Serve Corporate Communications Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Solders Thermal Interface Materials Thin-Film Materials Applications Brazing High-Temperature Soldering Connector Cable Assembly PCB Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Contact Us Main INDIUM CORPORATION Blog Entradas recientes Escudo de radiofrecuencias con Durafuse™ LT Friday , February 26, 2021 Qué tiene que ver DurafuseTM LT , una soldadura a baja temperatura con el escudo de radiofrecuencias Lea más Durafuse™ LT con LED Monday , February
Updated: 2021-03-22 02:23:46
Indium Corporation® Blog d'Indium Corporation People Careers Employee Bios Facilities Markets We Serve Corporate Communications Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Solders Thermal Interface Materials Thin-Film Materials Applications Brazing High-Temperature Soldering Connector Cable Assembly PCB Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Contact Us Main INDIUM CORPORATION Blog Messages récents Durafuse™ LT Blindage RF Friday , February 26, 2021 Quel est le rapport entre Durafuse TM LT une soudure à basse température et le blindage RF Apprenez en plus La soudure dans les dispositifs médicaux De quelle soudure
Updated: 2021-03-22 02:23:44
Indium Corporation® Indium 사의 블로그 People Careers Employee Bios Facilities Markets We Serve Corporate Communications Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Solders Thermal Interface Materials Thin-Film Materials Applications Brazing High-Temperature Soldering Connector Cable Assembly PCB Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Contact Us Main INDIUM CORPORATION Blog 한국어 SMT 조립은 최적화 공정입니다 Sunday , February 28, 2021 여러분 , SMT 조립은 최적화 공정입니다 . 모든 PWB 설계에 맞는 단일 스텐실 프린팅 공정은 없습니다 . 스텐실 설계의 스텐실 프린팅 매개변수들 . 추가 자료 참조 Durafuse™ LT RF 차단 Friday , February 26, 2021 DurafuseTM LT-저온 솔더는 RF 차단과 어떤 관련이 있습니까 추가 자료 참조 실질적 문제들을
Updated: 2021-03-22 02:23:41
Indium Corporation® Indium公司博客 People Careers Employee Bios Facilities Markets We Serve Corporate Communications Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Solders Thermal Interface Materials Thin-Film Materials Applications Brazing High-Temperature Soldering Connector Cable Assembly PCB Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Contact Us Main INDIUM CORPORATION Blog 最近的贴子 在超低温密封中使用铟(访问Kim Flanagan Monday , April 17, 2017 铟柔软可塑 非常适用于填充空隙 与其它密封材料相比 铟的独特之处在于它能在超低温度下保持良好的延展性 大部分其它密封材料在低温下不具有可塑性而且易碎 因而性能严重恶化 阅读更多 如何利用铟制造LED Wednesday , April 12, 2017 三氯化铟是用于制造LED的重要化合物 阅读更多 铟的六大独特属性(如何让其为您效力 Monday , March 13, 2017
Updated: 2021-03-22 02:23:41
Updated: 2021-03-22 02:23:40
Indium Corporation® Indium公司部落格 People Careers Employee Bios Facilities Markets We Serve Corporate Communications Quality Social Responsibility Universities Research Products Electroplating Fluxes Inorganic Compounds Metals Reclaim Recycle Solders Thermal Interface Materials Thin-Film Materials Applications Brazing High-Temperature Soldering Connector Cable Assembly PCB Assembly Sealing Semiconductor Packaging Assembly Soldering to Gold Target Bonding Thermal Evaporation PVD Coating Thermal Management Contact Us Main INDIUM CORPORATION Blog 最近的貼子 金錫共晶焊料 Friday , February 17, 2017 金錫共晶焊料(AuSn20,即按重量分數計算 : 37329 80 錫20 適用于要求高可靠性 高熔點焊點的各種應用 閱讀更多 鍵合非金屬表面 充分運用銦的獨特屬性 Monday , February 13, 2017 充分運用銦的獨特屬性來鍵合非金屬表 面 閱讀更多 Project 99 : 對抗波峰焊中的電遷移 Tuesday , January 31, 2017 克服電遷移可以防止波峰焊中的晶粒生長和電氣洩漏問題
Updated: 2021-03-22 02:23:37
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Updated: 2021-03-22 02:23:34
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Updated: 2021-03-22 02:23:27
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Updated: 2021-03-22 02:23:24
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Updated: 2021-03-22 02:23:15
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Updated: 2021-03-22 02:23:14
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Updated: 2021-03-22 02:23:13
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Updated: 2021-03-22 02:23:08
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Updated: 2021-03-18 14:54:00
SMIC, the Shanghai foundry, and the Chinese municipality of Shenzhen are to invest $2.35 billion to build a 28nm fab in Shenzhen. 28nm was first used in the industry in 2011. SMIC will take a 55% stake and the city will take 23%. The remaining 22% appears to be up for grabs. “The company and Shenzhen government will jointly drive other third-party investors to complete the remaining capital contribution,” said a stock exchange filing detailing the project. The plan is run first silicon in 2022 View the full article HERE